Light emitting diode package structure

ABSTRACT

A light emitting diode package structure includes a substrate, a light emitting unit, a wavelength conversion layer, and a reflective structure. The light emitting unit and the reflective structure are disposed on a mounting surface of the substrate. The wavelength conversion layer is disposed on the light emitting unit. The wavelength conversion layer has a light input surface, a top light output surface opposite to the light input surface, and a side light output surface connecting the light input surface and the top light output surface. The reflective structure surrounds the light emitting unit and the wavelength conversion layer. The reflective structure has a top reflecting surface located on a top of the reflective structure, and a height position of the top reflecting surface is higher than a height position of the light input surface and lower than a height position of the top light output surface.

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to China PatentApplication No. 202010561361.9, filed on Jun. 18, 2020 in People'sRepublic of China. The entire content of the above identifiedapplication is incorporated herein by reference.

Some references, which may include patents, patent applications andvarious publications, may be cited and discussed in the description ofthis disclosure. The citation and/or discussion of such references isprovided merely to clarify the description of the present disclosure andis not an admission that any such reference is “prior art” to thedisclosure described herein. All references cited and discussed in thisspecification are incorporated herein by reference in their entiretiesand to the same extent as if each reference was individuallyincorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a package structure, and moreparticularly to a light emitting diode package structure.

BACKGROUND OF THE DISCLOSURE

A light emitting diode (LED) has advantages of low energy consumption,long service life, and good luminous efficiency. In addition, the LEDcan withstand repeated switching operations. Therefore, fluorescentlamps on the market are gradually replaced with the LED to serve as alight source. Generally, material and metal electrodes of the LED areeasily oxidized by being in contact with water vapor and oxygen.Accordingly, the LED is usually packaged to prevent water vapor andoxygen from coming in contact with the LED.

Referring to FIG. 12, a conventional LED package structure is shown. TheLED serves as a light emitting unit 20′. The light emitting unit 20′ isdisposed on a substrate 10′. A wavelength conversion layer 40′ isdisposed on the light emitting unit 20′. Accordingly, when a lightgenerated by the light emitting unit 20′ passes through the wavelengthconversion layer 40′, color of the light is converted into anothercolor. An adhesive layer 30′ can be disposed between the light emittingunit 20′ and the wavelength conversion layer 40′. A reflective structure50′ is disposed on the substrate 10′ and surrounds the light emittingunit 20′ and the wavelength conversion layer 40′. A top reflectingsurface 51′ of the reflective structure 50′ is flush with a top lightoutput surface 42′ of the wavelength conversion layer 40′.

However, in the LED package structure shown in FIG. 12, an entire sidelight output surface 43′ of the wavelength conversion layer 40′ and anentire peripheral surface 22′ of the light emitting unit 20′ are incontact with the reflective structure 50′, so that it is not possiblefor the light to be emitted out from the side light output surface 43′of the wavelength conversion layer 40′ and the entire peripheral surface22′ of the light emitting unit 20′. Accordingly, the luminous efficiencyof the LED package structure is negatively affected, and a yellow-ringphenomenon occurs easily.

FIG. 13 is a simulation diagram of a light distribution curve of the LEDpackage structure shown in FIG. 12. Referring to FIG. 13, differences oflight intensities at different angles of the conventional LED packagestructure are great; that is, a light uniformity of the conventional LEDpackage structure is poor.

Referring to FIG. 14, another conventional LED package structure isshown. The conventional LED package structure shown in FIG. 14 issimilar to the conventional LED package structure shown in FIG. 12. Theconventional LED package structure shown in FIG. 14 further includes aspace-filling material 70′, and the light emitting unit 20′ includes aplurality of LED chips. The plurality of LED chips are spaced apart fromone another. Therefore, the space-filling material 70′ is filled notonly between the light emitting unit 20′ and the reflective structure50′, but also between the plurality of LED chips.

Similarly, in the LED package structure shown in FIG. 14, a topreflecting surface 51′ of the reflective structure 50′ is flush with atop light output surface 42′ of the wavelength conversion layer 40′.Therefore, the LED package structure shown in FIG. 14 also has problemsof poor luminous efficiency and the yellow-ring phenomenon.

Accordingly, the conventional LED package structure needs to be improvedso as to maintain the advantage of being small in size and enhance theluminous efficiency of the LED after packaging.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the presentdisclosure provides an LED package structure.

In one aspect, the present disclosure provides an LED package structure.The LED package structure includes a substrate, a light emitting unit, awavelength conversion layer, and a reflective structure. The substratehas a mounting surface. The light emitting unit is disposed on themounting surface. The light emitting unit had a light emitting surface.The wavelength conversion layer is disposed on the light emitting unit.The wavelength conversion layer has a light input surface facing towardthe light emitting surface, a top light output surface opposite to thelight input surface, and a side light output surface connecting thelight input surface and the top light output surface. The reflectivestructure is disposed on the mounting surface. The reflective structurehas an inner reflecting surface surrounding the light emitting unit andthe wavelength conversion layer. The reflective structure has a topreflecting surface located on a top of the reflective structure andconnected with the inner reflecting surface. The top reflecting surfaceis located at a higher position than that of the light input surface andis located at a lower position than that of the top light outputsurface.

In certain embodiments, the top reflecting surface of the reflectivestructure is parallel to the mounting surface.

In certain embodiments, the top reflecting surface of the reflectivestructure is tilted at a predetermined angle relative to the mountingsurface. The predetermined angle is larger than 0 and smaller than 90degrees.

In certain embodiments, the predetermined angle ranges from 25 to 65degrees.

In certain embodiments, the light emitting diode package structurefurther includes a light-permeable body. The light-permeable body isdisposed on the top reflecting surface and in contact with the sidelight output surface of the wavelength conversion layer.

In certain embodiments, a refractive index of the light-permeable bodyranges between a refractive index of the wavelength conversion layer anda refractive index of the air.

In certain embodiments, a light transmittance of the light-permeablebody is higher than or equal to 90%.

In certain embodiments, the light-permeable body has a top surface thatis flush with the top light output surface of the wavelength conversionlayer.

In certain embodiments, an area of the light emitting surface is largerthan an area of the light input surface.

In certain embodiments, the wavelength conversion layer has an outer endthat is limited in position on the reflective structure.

In certain embodiments, the reflective structure encloses a peripheralsurface of the light emitting unit.

In certain embodiments, the light emitting unit includes a plurality oflight emitting diodes spaced apart from one another.

In certain embodiments, the light emitting unit is separated from thereflective structure by at least one gap.

In certain embodiments, the light emitting diode package structurefurther includes a space-filling material that is filled in the at leastone gap.

In certain embodiments, the light emitting unit includes one lightemitting diode chip or a plurality of light emitting diode chips. Eachof the light emitting diode chip is a horizontal light emitting diodechip, a vertical light emitting diode chip, or a flip-chip lightemitting diode chip.

Therefore, by virtue of “the height position of the top reflectingsurface is higher than the height position of the light input surfaceand lower than the height position of the top light output surface”, theluminous efficiency of the LED package structure of the presentdisclosure can be enhanced.

These and other aspects of the present disclosure will become apparentfrom the following description of the embodiment taken in conjunctionwith the following drawings and their captions, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will become more fully understood from thefollowing detailed description and accompanying drawings.

FIG. 1 is a cross-sectional side view of an LED package structureaccording to a first embodiment of the present disclosure.

FIG. 2 is a cross-sectional side view of the LED package structureaccording to a second embodiment of the present disclosure.

FIG. 3 is a cross-sectional side view of the LED package structureaccording to a third embodiment of the present disclosure.

FIG. 4 is a cross-sectional side view of the LED package structureaccording to a fourth embodiment of the present disclosure.

FIG. 5 is a cross-sectional side view of the LED package structureaccording to a fifth embodiment of the present disclosure.

FIG. 6 is a cross-sectional side view of the LED package structureaccording to a sixth embodiment of the present disclosure.

FIG. 7 is a cross-sectional side view of the LED package structureaccording to a seventh embodiment of the present disclosure.

FIG. 8 is a cross-sectional side view of the LED package structureaccording to an eighth embodiment of the present disclosure.

FIG. 9 is a cross-sectional side view of the LED package structureaccording to a ninth embodiment of the present disclosure.

FIG. 10 is a cross-sectional side view of the LED package structureaccording to a tenth embodiment of the present disclosure.

FIG. 11 is a simulation diagram of a light distribution curve of the LEDpackage structure according to the first embodiment of the presentdisclosure.

FIG. 12 is a cross-sectional side view of a conventional LED packagestructure.

FIG. 13 is a simulation diagram of a light distribution curve of theconventional LED package structure shown in FIG. 12.

FIG. 14 is a cross-sectional side view of another conventional LEDpackage structure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the followingexamples that are intended as illustrative only since numerousmodifications and variations therein will be apparent to those skilledin the art. Like numbers in the drawings indicate like componentsthroughout the views. As used in the description herein and throughoutthe claims that follow, unless the context clearly dictates otherwise,the meaning of “a”, “an”, and “the” includes plural reference, and themeaning of “in” includes “in” and “on”. Titles or subtitles can be usedherein for the convenience of a reader, which shall have no influence onthe scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art.In the case of conflict, the present document, including any definitionsgiven herein, will prevail. The same thing can be expressed in more thanone way. Alternative language and synonyms can be used for any term(s)discussed herein, and no special significance is to be placed uponwhether a term is elaborated or discussed herein. A recital of one ormore synonyms does not exclude the use of other synonyms. The use ofexamples anywhere in this specification including examples of any termsis illustrative only, and in no way limits the scope and meaning of thepresent disclosure or of any exemplified term. Likewise, the presentdisclosure is not limited to various embodiments given herein. Numberingterms such as “first”, “second” or “third” can be used to describevarious components, signals or the like, which are for distinguishingone component/signal from another one only, and are not intended to, norshould be construed to impose any substantive limitations on thecomponents, signals or the like.

To overcome a disadvantage of a conventional LED after packaging, whichis poor luminous efficiency, the present disclosure provides an LEDpackage structure. In the LED package structure of the presentdisclosure, a reflective structure surrounds a wavelength conversionlayer without completely obstructing a side light output surface of thewavelength conversion layer.

Therefore, an amount of light absorbed by the reflective structure canbe reduced so that the luminous efficiency of the LED package structurecan be enhanced.

Referring to FIG. 1, the LED package structure of the present disclosureincludes: a substrate 10, a light emitting unit 20, an adhesive layer30, a wavelength conversion layer 40, and a reflective structure 50.

The substrate 10 has a mounting surface 11.

The light emitting unit 20 is disposed on the mounting surface 11 of thesubstrate 10. The light emitting unit 20 has a light emitting surface 21and a peripheral surface 22. The light emitting surface 21 is located ona side of the light emitting unit 20 opposite to the substrate 10. Theperipheral surface 22 is connected with the light emitting surface 21.The light emitting unit 20 can include one or more LED chips. The LEDchip can be, but not limited to, a horizontal LED chip, a vertical LEDchip, or a flip-chip LED chip.

The adhesive layer 30 is disposed on the light emitting unit 20. Theadhesive layer 30 is an optional element. Whether or not the adhesivelayer 30 is disposed can be decided according to an adhesive strengthbetween the light emitting unit 20 and the wavelength conversion layer40. The adhesive layer 30 is a transparent layer. Specifically, amaterial of the adhesive layer 30 includes a silicone resin or an epoxyresin. In other words, the adhesive layer 30 allows a light generated bythe light emitting unit 20 to pass through.

The wavelength conversion layer 40 can be directly disposed on the lightemitting unit 20 or indirectly disposed on the light emitting unit 20via the adhesive layer 30, so that when the light generated by the lightemitting unit 20 passes through the wavelength conversion layer 40, acolor of the light can be converted into an ideal color. The wavelengthconversion layer 40 has a light input surface 41 facing toward the lightemitting surface 21, a top light output surface 42 opposite to the lightinput surface 41, and a side light output surface 43 connecting thelight input surface 41 and the top light output surface 42.Specifically, the light input surface 41 of the wavelength conversionlayer 40 faces toward the light emitting surface 21 of the lightemitting unit 20. Therefore, the light generated by the light emittingunit 20 can enter the wavelength conversion layer 40 via the light inputsurface 41, and then the light, after passing through the wavelengthconversion layer 40, can be emitted from the top light output surface 42or the side light output surface 43. In addition, in some embodimentsnot shown, an area of the top light output surface 42 of the wavelengthconversion layer 40 is slightly larger than an area of the light inputsurface 41 so as to further enhance the luminous efficiency of the LEDpackage structure.

The reflective structure 50 is disposed on the mounting surface 11 ofthe substrate 10. The reflective structure 50 has a top reflectingsurface 51 and an inner reflecting surface 52 that are connected witheach other. The top reflecting surface 51 of the reflective structure 50can be a roughened surface. The inner reflecting surface 52 of thereflective structure 50 surrounds the light emitting unit 20, theadhesive layer 30, and the wavelength conversion layer 40, withoutcompletely obstructing the side light output surface 43 of thewavelength conversion layer 40. Accordingly, the light generated by thelight emitting unit 20 will not be excessively reflected by thereflective structure 50, so that the luminous efficiency of the LEDpackage structure can be enhanced and a yellow-ring phenomenon can bereduced. Therefore, the LED package structure of the present disclosureis advantageous when being applied in automobile lamps.

The following description will illustrate specific structures in eachembodiment in more detail.

First Embodiment

Referring to FIG. 1, a shape of the light input surface 41 of thewavelength conversion layer 40 corresponds to a shape of the lightemitting surface 21 of the light emitting unit 20. In addition, an areaof the light input surface 41 is equal to an area of the light emittingsurface 21. In the first embodiment, the adhesive layer 30 is disposedbetween the light emitting unit 20 and the wavelength conversion layer40.

The top reflecting surface 51 of the reflective structure 50 is locatedat a position higher than that of the light input surface 41 and islocated at a position lower than that of the top light output surface42. Accordingly, the light generated by the light emitting unit 20 canbe dispersed from the side light output surface 43 of the wavelengthconversion layer 40 so that the luminous efficiency of the LED packagestructure can be enhanced and the yellow-ring phenomenon can be reduced.

In the first embodiment, the top reflecting surface 51 of the reflectivestructure 50 is parallel to the mounting surface 11 of the substrate 10,but is not limited thereto. In other embodiments, the top reflectingsurface 51 of the reflective structure 50 can be tilted at apredetermined angle relative to the mounting surface 11.

The light emitting unit 20, the adhesive layer 30, and the wavelengthconversion layer 40 are surrounded by the inner reflecting surface 52 ofthe reflective structure 50. Therefore, the inner reflecting surface 52of the reflective structure 50 contacts the peripheral surface 22 of thelight emitting unit 20. It should be noted that the inner reflectingsurface 52 of the reflective structure 50 contacts a part of the sidelight output surface 43 of the wavelength conversion layer 40, but theside light output surface 43 of the wavelength conversion layer 40 isnot completely obstructed by the inner reflecting surface 52 of thereflective structure 50. Accordingly, the LED package structure can havea better luminous efficiency. Further, in the first embodiment, theperipheral surface 22 of the light emitting unit 20 is enclosed by thereflective structure 50; that is, the peripheral surface 22 of the lightemitting unit 20 is directly encapsulated by the reflective structure50. However, the present disclosure is not limited thereto. In otherembodiments mentioned below, the reflective structure 50 is separatedfrom the peripheral surface 22 of the light emitting unit 20 by a gap.Such variations are still within the scope of the present disclosure.

In the first embodiment, the inner reflecting surface 52 of thereflective structure 50 is perpendicular to the mounting surface 11 ofthe substrate 10, but it is not limited thereto. In other embodiments,the inner reflecting surface 52 of the reflective structure 50 can betilted at an angle relative to the mounting surface 11 of the substrate10 so as to meet specification requirements of different products.

Second Embodiment

Referring to FIG. 2, the LED package structure of the second embodimentis similar to the LED package structure of the first embodiment. Thedifference is that the LED package structure of the second embodimentfurther includes a light-permeable body 60. The light-permeable body 60is disposed on the top reflecting surface 51 of the reflective structure50 and contacts the side light output surface 43 of the wavelengthconversion layer 40. Specifically, a concave region is formed betweenthe top reflecting surface 51 of the reflective structure 50 and theside light output surface 43 of the wavelength conversion layer 40. Thelight-permeable body 60 is filled in the concave region.

A material of the light-permeable body 60 includes a silicone resin oran epoxy resin. A refractive index of the light-permeable body 60 rangesbetween a refractive index of the wavelength conversion layer 40 and arefractive index of the air. Accordingly, the light can be converged bythe light-permeable body 60, and the light-permeable body 60 can have asimilar function as a light guide component. Specifically, a lighttransmittance of the light-permeable body 60 needs to be greater than orequal to 90%, and preferably the material of the light-permeable body 60does not contain light diffusing particles so as to achieve a good lightguiding effect.

Specifically, the light-permeable body 60 has a top surface 61 and aside surface 62. The top surface 61 is flush with the top light outputsurface 42 of the wavelength conversion layer 40. The side surface 62contacts the side light output surface 43 of the wavelength conversionlayer 40. Therefore, the light emitted from the side light outputsurface 43 can be converged by the light-permeable body 60 so that thelight-permeable body 60 achieves the good light guiding effect. Giventhat the refractive index of the light-permeable body 60 ranges betweenthe refractive index of the wavelength conversion layer 40 and therefractive index of the air, a phenomenon of total internal reflectioncan be prevented when the light is emitted from the side light outputsurface 43 of the wavelength conversion layer 40. Therefore, compared tothe first embodiment, the light-permeable body 60 of the secondembodiment can prevent the phenomenon of the total internal reflection,thereby enhancing the luminous efficiency of the LED package structure,and reducing the yellow-ring phenomenon.

Third Embodiment

Referring to FIG. 3, the LED package structure of the third embodimentis similar to the LED package structure of the second embodiment. Thedifference is that the area of the light input surface 41 of thewavelength conversion layer 40 is larger than the area of the lightemitting surface 21 of the light emitting unit 20, so that anillumination area of the LED package structure can be enlarged and theluminous efficiency of the LED package structure can be enhanced.

Specifically, the light emitting surface 21 of the light emitting unit20 is completely covered by the light input surface 41 of the wavelengthconversion layer 40. An outer end 44 of the wavelength conversion layer40 is limited in position on the reflective structure 50. In otherwords, a retaining groove is concavely formed at a junction extendingfrom the top reflecting surface 51 and the inner reflecting surface 52of the reflective structure 50. The outer end 44 is located at ajunction between the light input surface 41 and the side light outputsurface 43 of the wavelength conversion layer 40, and can be disposed inthe retaining groove.

Fourth Embodiment

Referring to FIG. 4, the LED package structure of the fourth embodimentis similar to the LED package structure of the first embodiment. Thedifference is that the top reflecting surface 51 of the reflectivestructure 50 is not parallel to the mounting surface 11 of the substrate10. The top reflecting surface 51 is tilted at a predetermined angle θrelative to the mounting surface 11, and faces toward the side lightoutput surface 43 of the wavelength conversion layer 40. Accordingly,the light emitted from the side light output surface 43 can be reflectedby the top reflecting surface 51, so that the luminous efficiency of theLED package structure can be enhanced. Specifically, the predeterminedangle θ ranges from 0 to lower than 90 degrees; preferably, thepredetermined angle θ ranges from 25 to 65 degrees.

Fifth Embodiment

Referring to FIG. 5, the LED package structure of the fifth embodimentis similar to the LED package structure of the fourth embodiment. Thedifference is that the LED package structure of the fifth embodimentfurther includes the light-permeable body 60 (previously mentioned inthe second embodiment). The light-permeable body 60 is disposed on thetop reflecting surface 51 of the reflective structure 50 and filled inthe concave region formed by the top reflecting surface 51 and the sidelight output surface 43. The material of the light-permeable body 60,the refractive index of the light-permeable body 60, and the specificstructure of the light-permeable body 60 in the fifth embodiment are thesame with those in the second embodiment and will not be repeatedherein.

In each of the second embodiment, the third embodiment, and the fifthembodiment, there is a different relative arrangement among thewavelength conversion layer 40, the reflective structure 50, and thelight-permeable body 60. Accordingly, the LED package structure can emitlights with various light forms so as to meet different requirements.For example, the LED package structure can be applied in automobilelamps of different types, such as a headlight, a direction light, awarning light, or a rear light. However, no matter how the relativearrangement is adjusted among the wavelength conversion layer 40, thereflective structure 50, and the light-permeable body 60, the LEDpackage structure can have good luminous efficiency, so long as thewavelength conversion layer 40 is surrounded by the reflective structure50 and the side light output surface 43 is not completely obstructed bythe reflective structure 50.

Sixth Embodiment

Referring to FIG. 6, the LED package structure of the sixth embodimentis similar to the LED package structure of the second embodiment. Thedifference is that the LED package structure of the sixth embodimentfurther includes a space-filling material 70. The space-filling material70 is a transparent material so as to allow the light generated by thelight emitting unit 20 to pass through.

Specifically, at least one gap is formed between the light emitting unit20 and the reflective structure 50. The space-filling material 70 isfilled in the at least one gap. Further, the space-filling material 70and the light emitting unit 20 are covered by the adhesive layer 30. Inother words, the peripheral surface 22 of the light emitting unit 20does not contact the inner reflecting surface 52 of the reflectivestructure 50. The light emitting unit 20 is surrounded by thespace-filling material 70, and the peripheral surface 22 of the lightemitting unit 20 and the inner reflecting surface 52 of the reflectivestructure 50 are both in contact with the space-filling material 70.

Seventh Embodiment

Referring to FIG. 7, the LED package structure of the seventh embodimentis similar to the LED package structure of the first embodiment. Thedifference is that the LED package structure of the seventh embodimentfurther includes the space-filling material 70 (previously mentioned inthe sixth embodiment), and the light emitting unit 20 has a plurality ofLEDs.

Specifically, the plurality of LEDs are spaced apart from one another.Therefore, the space-filling material 70 is not only filled in the atleast one gap but also filled among the plurality of LEDs.

Eighth Embodiment

Referring to FIG. 8, the LED package structure of the eighth embodimentis similar to the LED package structure of the seventh embodiment. Thedifference is that the LED package structure of the eighth embodimentfurther includes the light-permeable body 60 (previously mentioned inthe second embodiment). The light-permeable body 60 is disposed on thetop reflecting surface 51 of the reflective structure 50 and filled inthe concave region formed by the top reflecting surface 51 and the sidelight output surface 43. The material of the light-permeable body 60,the refractive index of the light-permeable body 60, and the specificstructure of the light-permeable body 60 in the eighth embodiment arethe same with those in the second embodiment and will not be repeatedherein.

Ninth Embodiment

Referring to FIG. 9, the LED package structure of the ninth embodimentis similar to the LED package structure of the fourth embodiment. Thedifference is that the top reflecting surface 51 of the reflectivestructure 50 has an upper edge 511 and a lower edge 512 that areopposite to each other. A height position of the upper edge 511 is thesame as a height position of the top light output surface 42, and aheight position of the lower edge 512 is the same as a height positionof the light input surface 41. In other words, the wavelength conversionlayer 40 is still surrounded by the reflective structure 50, but theside light output surface 43 of the wavelength conversion layer 40 iscompletely exposed to an external environment.

In the ninth embodiment, although the height position of the topreflecting surface 51 is not higher than the height position of thelight input surface 41, the top reflecting surface 51 is tilted at thepredetermined angle θ relative to the mounting surface 11, so that theLED package structure of the ninth embodiment still conforms to therelative arrangement of having the wavelength conversion layer 40surrounded by the reflective structure 50 but the side light outputsurface 43 of the wavelength conversion layer 40 being not completelyobstructed by the reflective structure 50. Therefore, in the ninthembodiment, the luminous efficiency of the LED package structure stillcan be enhanced.

Tenth Embodiment

Referring to FIG. 10, the LED package structure of the tenth embodimentis similar to the LED package structure of the ninth embodiment. Thedifference is that the LED package structure of the tenth embodimentfurther includes the light-permeable body 60 (previously mentioned inthe second embodiment). The light-permeable body 60 is disposed on thetop reflecting surface 51 of the reflective structure 50 and filled inthe concave region formed by the top reflecting surface 51 and the sidelight output surface 43. The material of the light-permeable body 60,the refractive index of the light-permeable body 60, and the specificstructure of the light-permeable body 60 in the tenth embodiment are thesame with those in the second embodiment and will not be repeatedherein.

To prove that the LED package structure of the present disclosure has abetter luminous efficiency, radiance and luminance of the LED packagestructure of the present disclosure (in Examples 1 to 3) and radianceand luminance of the conventional LED package structure (in ComparativeExamples 1 and 2) are measured and listed in Table 1, respectively.

The LED package structure of Examples 1 and 2 are respectivelycorresponding to the LED package structure of the first embodiment(FIG. 1) and the second embodiment (FIG. 2). In each of Examples 1 and2, a height difference (Δh) between the top reflecting surface 51 andthe top light output surface 42 is 130 μm. The LED package structure ofComparative Example 1 corresponds to the LED package structure shown inFIG. 13. In Comparative Example 1, a height difference (Δh) between thetop reflecting surface 51′ and the top light output surface 42′ is 0 μm.That is, the top reflecting surface 51′ is flush with the top lightoutput surface 42′.

The LED package structure of Example 3 corresponds to the LED packagestructure of the first embodiment (FIG. 1). In Example 3, a heightdifference (Δh) between the top reflecting surface 51 and the top lightoutput surface 42 is 150 μm. The LED package structure of ComparativeExample 2 corresponds to the LED package structure shown in FIG. 13. InComparative Example 2, a height difference (Δh) between the topreflecting surface 51′ and the top light output surface 42′ is 0 μm.That is, the top reflecting surface 51′ is flush with the top lightoutput surface 42′.

TABLE 1 Property LED package structure Δh (μm) Radiance (watt) Luminance(lm) Example 1 130 0.91 367.1 Example 2 130 0.93 375.3 ComparativeExample 1 0 0.83 357.4 Example 3 150 — 376 Comparative Example 2 0 — 322

According to Table 1, radiances and luminances of Examples 1 to 3 arehigher than radiances and luminances of Comparative Examples 1 and 2.Therefore, the relative arrangement of having the wavelength conversionlayer 40 surrounded by the reflective structure 50 but the side lightoutput surface 43 of the wavelength conversion layer 40 being notcompletely obstructed by the reflective structure 50 can enhance theluminous efficiency of the LED package structure.

In addition, in order to quantify the enhancement of brightness betweenExamples and Comparative Examples, a brightness-enhanced ratio iscalculated by dividing a difference of brightness between Example andComparative Example by the brightness of Comparative Example. Based onthe brightness of Comparative Example 1, the brightness-enhanced ratiosof Examples 1 and 2 respectively are 2.7% and 5.0%. Based on thebrightness of Comparative Example 2, the brightness-enhanced ratio ofExample 3 is 16.8%.

Moreover, the LED package structure of the present disclosure not onlyhas a good luminous efficiency but also has a uniform light distributioncurve. Referring to FIG. 11, a simulation diagram of light distributioncurve of the LED package structure according to the first embodiment(FIG. 1) of the present disclosure is shown. According to FIG. 11, theLED package structure of the present disclosure has a wider beam angleand the differences of light intensities at different angles are small.Accordingly, a yellow-ring phenomenon of the LED package structure canbe reduced, and the LED package structure can be applied in variousfields, especially in a field of automobile lamps.

In conclusion, by virtue of “the top reflecting surface 51 is located ata position higher than that of the light input surface 41 and is locatedat a position lower than that of the top light output surface 42”, theluminous efficiency of the LED package structure of the presentdisclosure can be enhanced.

Further, by virtue of “the LED package structure of the presentdisclosure further includes a light-permeable body 60”, the light can beconverged by the light-permeable body 60.

Further, by virtue of “the refractive index of the light-permeable body60 ranges between the refractive index of the wavelength conversionlayer 40 and the refractive index of the air”, the light can beconverged by the light-permeable body 60.

The foregoing description of the exemplary embodiments of the disclosurehas been presented only for the purposes of illustration and descriptionand is not intended to be exhaustive or to limit the disclosure to theprecise forms disclosed. Many modifications and variations are possiblein light of the above teaching.

The embodiments were chosen and described in order to explain theprinciples of the disclosure and their practical application so as toenable others skilled in the art to utilize the disclosure and variousembodiments and with various modifications as are suited to theparticular use contemplated. Alternative embodiments will becomeapparent to those skilled in the art to which the present disclosurepertains without departing from its spirit and scope.

What is claimed is:
 1. A light emitting diode package structure,comprising: a substrate having a mounting surface; a light emitting unitdisposed on the mounting surface, the light emitting unit having a lightemitting surface; a wavelength conversion layer disposed on the lightemitting unit, the wavelength conversion layer having a light inputsurface facing the light emitting surface, a top light output surfaceopposite to the light input surface, and a side light output surfaceconnected to the light input surface and the top light output surface; areflective structure disposed on the mounting surface, the reflectivestructure having an inner reflecting surface surrounding the lightemitting unit and the wavelength conversion layer and a top reflectingsurface located on a top thereof and connected to the inner reflectingsurface; wherein the side light output surface of the wavelengthconversion layer is not completely obstructed by the inner reflectingsurface of the reflective structure; wherein the top reflecting surfaceis located at a higher position than that of the light input surface,and is located at a lower position than that of the top light outputsurface.
 2. The light emitting diode package structure according toclaim 1, wherein the top reflecting surface of the reflective structureis parallel to the mounting surface.
 3. The light emitting diode packagestructure according to claim 1, wherein the top reflecting surface ofthe reflective structure is tilted at a predetermined angle relative tothe mounting surface, and the predetermined angle is larger than 0degrees and smaller than 90 degrees.
 4. The light emitting diode packagestructure according to claim 3, wherein the predetermined angle rangesfrom 25 degrees to 65 degrees.
 5. The light emitting diode packagestructure according to claim 1, further comprising a light-permeablebody being disposed on the top reflecting surface and in contact withthe side light output surface of the wavelength conversion layer.
 6. Thelight emitting diode package structure according to claim 5, wherein arefractive index of the light-permeable body ranges between a refractiveindex of the wavelength conversion layer and a refractive index of air.7. The light emitting diode package structure according to claim 5,wherein a light transmittance of the light-permeable body is higher thanor equal to 90%.
 8. The light emitting diode package structure accordingto claim 5, wherein the light-permeable body has a top surface that isflush with the top light output surface of the wavelength conversionlayer.
 9. The light emitting diode package structure according to claim1, wherein an area of the light emitting surface is larger than an areaof the light input surface.
 10. The light emitting diode packagestructure according to claim 1, wherein the wavelength conversion layerhas an outer end that is limited in position on the reflectivestructure.
 11. The light emitting diode package structure according toclaim 1, wherein the reflective structure encloses a peripheral surfaceof the light emitting unit.
 12. The light emitting diode packagestructure according to claim 1, wherein the light emitting unit includesa plurality of light emitting diodes spaced apart from one another. 13.The light emitting diode package structure according to claim 1, whereinthe light emitting unit is separated from the reflective structure by atleast one gap.
 14. The light emitting diode package structure accordingto claim 13, further comprising a space-filling material that is filledin the at least one gap.
 15. The light emitting diode package structureaccording to claim 12, wherein the light emitting unit is separated fromthe reflective structure by at least one gap.
 16. The light emittingdiode package structure according to claim 15, further comprising aspace-filling material that is filled in the at least one gap.
 17. Thelight emitting diode package structure according to claim 1, wherein thelight emitting unit includes one or more light emitting diode chips, andthe light emitting diode chip is a horizontal light emitting diode chip,a vertical light emitting diode chip, or a flip-chip light emittingdiode chip.